3M Scotch-Weld Structural Adhesive Film AF 163-2K 0,060 wt-Red-36inx5yrd
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A thermosetting modified epoxy structural adhesive in film form
Description
Designed for 250°F (120°C) cure. Adhesive can be cured from 180°F (80°C) up to 300°F (150°C). Excellent shop handling characteristics. Excellent pre-bond humidity performance on composite substrates. Unsupported version available for reticulation. High-fracture toughness and peel strength